Integrating the TRIZ and Taguchi’s Method in the Optimization of Processes Parameters for SMT

勤益科大機構典藏 > 管理學院 > 工業工程與管理系(所) > 【工業工程與管理系所】期刊論文 > Item 987654321/6199

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題名:	Integrating the TRIZ and Taguchi’s Method in the Optimization of Processes Parameters for SMT
作者:	林文燦
貢獻者:	工業工程與(工程)管理系
日期:	2013-01
上傳時間:	2017-09-30 13:11:13 (UTC+8)
摘要:	SMT is an assembly technology for core circuit board parts. Unless process parameters are effectively controlled, poor solderability may result in a decline in product quality. This study looks at an SMT manufacturing process in a multinational company. First, the TRIZ contradiction matrix is revised to investigate the association between the 39 parameters in the contradiction matrix and 13 parameters that influence the unevenness of solder paste in the solder paste printing process. Expert verification is then used to screen the key factors affecting the quality of SMT, which are then combined with Taguchi's method to identify the optimal parameter set influencing the thickness of SMT solder paste. Results. TRIZ identifies squeegee pressure, ejection speed, squeegee speed, and squeegee angle as the four parameters with the greatest influence on SMT solder paste thickness. Taguchi's method is used to identify the optimum levels set for the experimental factors and carry out confirmation experiments. The S/N ratio improved from 21.732 db to 26.632 db, while the mean also improved from the current 0.163 mm to 0.155 mm, close to the target value of 0.15 mm. The results show that applying TRIZ and Taguchi's method for the purpose of product improvement is feasible. © 2013 Yung-Tsan Jou et al. (36 refs)
關聯:	Advances in Materials Science and Engineering
顯示於類別:	[工業工程與管理系(所)] 【工業工程與管理系所】期刊論文

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