Dressing Behaviors of PCD Conditioners on CMP Polishing Pads

NCUTIR > College of Engineering > Department of Mechanical Engineering > 【機械工程系】期刊論文 > Item 987654321/6586

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Title:	Dressing Behaviors of PCD Conditioners on CMP Polishing Pads
Authors:	蔡明義
Contributors:	機械工程(學)系
Date:	2009-09
Issue Date:	2017-11-01 14:19:34 (UTC+8)
Abstract:	Diamond pad conditioner or dresser can determine the efficiency of chemical mechanical polishing (CMP) processes and the quality of polished wafers. Conventional diamond pad conditioners are made by adhering discrete diamond grits on a flat substrate. The size distribution of diamond grits coupled with the deformation of the substrate often make the tips of diamond grits lying at different heights. Instead of attaching individual diamond grits to a metal substrate, a revolutionary design of pad conditioners is based on carving a structure out of sintered polycrystalline diamond (PCD) matrix. The PCD dresser is manufactured by wire electro discharge machining to form cutting pyramids of a specific size with a designed shape. The dressing characteristics of pad surface textures are studied by comparison with conventional diamond pad conditioner. Experimental results indicate that the PCD dresser can dress asperities of the pad more uniformly than the conventional diamond dresser due to PCD dresser having identically shaped tip and the same height diamond. In addition the cutting rate of PCD dresser for IC1000 pad not only is reduced by about 30% but also it can dress pad more effectively than conventional diamond dresser.
Relation:	Advanced materials research
Appears in Collections:	[Department of Mechanical Engineering] 【機械工程系】期刊論文

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