Enhancement of Adhesion between Copper Foil and Polyimide Film Containing Thermally Decomposable Polystyrene Particles

勤益科大機構典藏 > 工程學院 > 化工與材料工程系(所) > 【化工與材料工程系】期刊論文 > Item 987654321/6631

jsp.display-item.identifier=請使用永久網址來引用或連結此文件: http://ir.lib.ncut.edu.tw/handle/987654321/6631

题名:	Enhancement of Adhesion between Copper Foil and Polyimide Film Containing Thermally Decomposable Polystyrene Particles
作者:	蔡美慧
贡献者:	化工與材料工程系
日期:	2011-07
上传时间:	2017-11-14 13:42:17 (UTC+8)
摘要:	A facile method was developed to synthesize porous polyimide (PI) films with enhanced adhesion to Cu foil. Various amounts (0.1–4 wt %) of polystyrene (PS) spheres with the diameter of 250 nm were mixed with the PI precursor synthesized from pyromellitic dianhydride (PMDA) and 4,4′-oxydianiline in N,N′-dimethylacetamide. PS was decomposed during thermal imidization process to create the porous PI structure. The increase in surface area and surface roughness was observed from the obtained porous PI films and was a function of the PS content up to 4 wt %. A significant improvement in the adhesion strength between porous PI film and Cu foil, which was determined by 90° peel test, was achieved. The adhesion strength of PI containing 4 wt % PS to Cu was 1.53 kgf/cm compared with pure PI of 1.08 kgf/cm. Meanwhile, the synthesized porous PI films exhibit sufficient mechanical strength and thermal stability for practical applications.
關聯:	J. Appl. Polym. Sci.
显示于类别:	[化工與材料工程系(所)] 【化工與材料工程系】期刊論文

文件中的档案:

没有与此文件相关的档案.

检视Licence

在NCUTIR中所有的数据项都受到原著作权保护.